Undergraduate Scholarships at Lewis in USA 2021 – Lewis University is offering international awards to overseas students to help them with educational costs while studying in the USA for the academic year 2022-2023.
The scholarship programme is open to all international students. Undergraduate or graduate-level study costs up to$15,000 can be covered with this grant.
Lewis University is a private Roman Catholic and Lasallian university in Romeoville ranking 19th in Regional Universities Midwest. Lewis University is recognized as one of the finest, mid-sized, comprehensive Catholic universities in the country.
Why choose to study at Lewis University? The university promotes the development of each individual through the pursuit of wisdom and justice. Its fundamental mission is to stay exclusively dedicated to education. LU is committed to help.
- Scholarship Program: International Awards.
- University or Organization: Lewis University.
- Degree Level: Undergraduate or Graduate.
- Award: Up to $15,000.
- Nationality: International.
- Can be taken in: USA.
Undergraduate Scholarships at Lewis in USA 2021
To be eligible, the applicants must meet all the following/given criteria:
- The applicants must be enrolled and accepted in the applied programme at LU.
All undergraduate or graduate study programmes offered at LU are eligible to apply for.
Programs offered by Lewis University Click Here.
Lewis University will reward scholarships worth $15,000 to the selected international students to pursue their higher education.
How to Apply
Students can start their undergraduate applications here and graduate applications here. International applicants will be considered automatically.
To apply, candidates must be ready to submit official transcripts from all previous colleges attended
NOTE: Generally, applications may be online, via e-mail or mail, and can be in Web Page, Word or PDF format. And after entering any link you will be directed directly to the requested page.
For more information about the scholarship Click Here.
Application Deadline is December 1, 2021